Why Review the T Series

Mitsubishi Electric's T-series IGBT modules are the seventh-generation standard-type power modules, and they promise low loss, rugged packaging and broad voltage coverage. This review examines the T series from the perspective of an FAE who supports customers through design-in and bring-up, focusing on loss, isolation, packaging and practical layout.

Loss and the CSTBT Chip

The T series uses the CSTBT chip structure, which Mitsubishi Electric developed to reduce both conduction and switching loss. On evaluation hardware, the measured loss tracked the datasheet closely, confirming that the specification is achievable in a well-built design. The practical consequence is that a designer can either keep the switching frequency and shrink the heatsink, or keep the heatsink and raise the frequency for smaller magnetics. For a motor drive or a solar inverter, that extra margin improves efficiency and, in the case of a drive, acoustic performance.

Switching Behavior

The module switches cleanly with predictable turn-off overshoot that tracks the gate resistor and the external loop. That predictability is valuable because it lets a designer budget overshoot with confidence and improve it by tightening the external busbar rather than fighting an unknown package. Keeping the commutation loop short is the main lever on overshoot and EMI.

Isolation and Packaging

The T-series package provides a flat base with a 4000 Vrms isolation voltage, which is a genuine practical advantage. Several modules can share a common heatsink without an additional insulating layer, so the mechanical design is simpler and the heat transfer is better. The dual configuration integrates two switches and their freewheeling diodes as one half-bridge leg, and the standard footprint mounts on common heatsinks. In many cases the module is a drop-in for an older design, which shortens a re-qualification.

Dual Configuration in Practice

The 2in1 dual arrangement is the building block of a three-phase bridge: three modules form a full inverter. It keeps each leg thermally independent and gives flexibility to add a brake or a separate leg. The low internal inductance of the package makes overshoot predictable, which is confirmed in our bench measurements.

Applications

The T series fits general-purpose and servo inverters, UPS systems, solar and wind converters, and traction auxiliaries. Its combination of low loss, 4000 Vrms isolation and a broad 650 V to 1700 V range makes it a strong default across these applications. Where the highest integration is wanted, a G1 or V1 series IPM is the natural companion.

Thermal Design

The T series tolerates a high operating temperature, which buys thermal margin if the rest of the design is sound. On the bench, case temperature rose predictably with load once the thermal interface was correct. As always, a thin, uniform interface and a flat, well-mounted heatsink are essential, and the flat base helps keep contact consistent.

Layout Practice

The T series rewards a disciplined layout. Keep the DC-link capacitor close to the module terminals with a low-inductance connection, size the gate resistor to control the edges within the EMI budget, and measure overshoot at the module terminals rather than at the bus. Because the package has low internal inductance, the external busbar is the dominant contributor to loop inductance, so tightening it pays off directly.

Conclusion

The Mitsubishi Electric T-series IGBT module delivers on its promises: low loss, robust 4000 Vrms isolation and a rugged, easy-to-mount package across a wide voltage range. In our evaluation it was straightforward to design in and reliable on the bench. For new inverter and power-conversion designs, it deserves to be on the shortlist, and BeiLuo's authorized stock and FAE support make evaluation easy.